Browsing by Author Wang, C Q

Jump to: 0-9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
or enter first few letters:  
Showing results 1 to 4 of 4
Issue DateTitleAuthor(s)Citation
2014Co-circulation of Hantaan, Kenkeme, and Khabarovsk Hantaviruses in Bolshoy Ussuriysky Island, ChinaHolmes, Edward; Gao, Jian-Hua; Guo, Wen-Ping; Hu, Man-Xia; Li, Ming; Li, Ming-Hui; Liang, Hui-Jie; Lu, M.-Q.; Tian, Xi-Feng; Wang, C Q; Wang, Wen; Yang, Jun; Zhang, Yong-Zhen; Sydney Institute for Emerging Infectious Diseases and BiosecCo-circulation of Hantaan, Kenkeme, and Khabarovsk Hantaviruses in Bolshoy Ussuriysky Island, China, Virus Research, vol.191, N/A, 2014,pp 51-58
2007Cross-interaction of interfacial reactions in Ni (Au/Ni/Cu)-SnAg-Cu solder joints during reflow soldering and thermal agingYan, Cheng; Chen, Hongtao; Huang, Y; Li, M Y; Wang, C Q; Aerospace Mech & M'tronic EngCross-interaction of interfacial reactions in Ni (Au/Ni/Cu)-SnAg-Cu solder joints during reflow soldering and thermal aging, Journal of Electronic Materials, vol.36,(1),2007,pp 26-32
2015Discovery, diversity and evolution of novel coronaviruses sampled from rodents in ChinaHolmes, Edward; Shi, Mang; Ge, Shuang; Guo, Wen-Ping; Li, Ming-Hui; Lin, Xian-Dan; Mei, Shenghua; Wang, C Q; Wang, M; Wang, Wen; Zhang, Y.-Z.; Zhou, Run-Hong; Biological Sciences; Biological SciencesDiscovery, diversity and evolution of novel coronaviruses sampled from rodents in China, Virology, vol.474, N/A, 2015,pp 19-27
2007Effects of solder volume on formation and redeposition of Au-containing intermetallics in Ni/Au-SnAgCu-Ni(P) solder jointsChen, Hongtao; Yan, Cheng; Huang, Y; Tian, Y. H.; Wang, C Q; Aerospace Mech & M'tronic Eng; Aerospace Mech & M'tronic EngEffects of solder volume on formation and redeposition of Au-containing intermetallics in Ni/Au-SnAgCu-Ni(P) solder joints, Journal of Electronic Materials, vol.36,(1),2007,pp 33-39