Browsing by Author Tian, Y. H.

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Issue DateTitleAuthor(s)Citation
2007Effects of solder volume on formation and redeposition of Au-containing intermetallics in Ni/Au-SnAgCu-Ni(P) solder jointsChen, Hongtao; Yan, Cheng; Huang, Y; Tian, Y. H.; Wang, C Q; Aerospace Mech & M'tronic Eng; Aerospace Mech & M'tronic EngEffects of solder volume on formation and redeposition of Au-containing intermetallics in Ni/Au-SnAgCu-Ni(P) solder joints, Journal of Electronic Materials, vol.36,(1),2007,pp 33-39