Browsing by Author Lim, K-M

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Issue DateTitleAuthor(s)Citation
2006Advances in vapor pressure modeling for electronic packagingMai, Yiu-Wing; Wong, E H; Koh, S W; Lee, Kyu-Haeng; Lim, K-M; Lim, T B; Aerospace Mech & M'tronic Eng; Aerospace Mech & M'tronic EngAdvances in vapor pressure modeling for electronic packaging, IEEE Transactions on Advanced Packaging, vol.29,(4),2006,pp 751-759
2007Analytical solutions for interconnect stress in board level drop impactMai, Yiu-Wing; Wong, E H; Lim, K-M; Lim, T B; Seah, Simon K. W.; Aerospace Mech & M'tronic Eng; Aerospace Mech & M'tronic EngAnalytical solutions for interconnect stress in board level drop impact, IEEE Transactions on Advanced Packaging, vol.30,(4),2007,pp 654-664
2009Analytical Solutions for PCB Assembly Subjected to Mismatched Thermal ExpansionMai, Yiu-Wing; Lim, K-M; Wong, E.H.; Aerospace Mech & M'tronic EngAnalytical Solutions for PCB Assembly Subjected to Mismatched Thermal Expansion, IEEE Transactions on Advanced Packaging, vol.32, 3,pp 2009-602