Browsing by Author Li, M Y

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Issue DateTitleAuthor(s)Citation
2007Cross-interaction of interfacial reactions in Ni (Au/Ni/Cu)-SnAg-Cu solder joints during reflow soldering and thermal agingYan, Cheng; Chen, Hongtao; Huang, Y; Li, M Y; Wang, C Q; Aerospace Mech & M'tronic EngCross-interaction of interfacial reactions in Ni (Au/Ni/Cu)-SnAg-Cu solder joints during reflow soldering and thermal aging, Journal of Electronic Materials, vol.36,(1),2007,pp 26-32