Browsing by Author Gu, Bin

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Showing results 1 to 7 of 7
Issue DateTitleAuthor(s)Citation
2007Effect of imput electric field on fatigue degradation on piezoelectric fibre bridging forceGu, Bin; Liu, Hong-Yuan; Mai, Yiu-Wing; Aerospace, Mechanical and Mechatronic Engineering; Aerospace, Mechanical and Mechatronic Engineering; Aerospace, Mechanical and Mechatronic EngineeringEffect of imput electric field on fatigue degradation on piezoelectric fibre bridging force, Key Engineering Materials, vol.334-335, N/A, 2007,pp 593-596
2008Fracture mechanics analysis of the effects of temperature and material mismatch on the Smart-Cut® technology.Gu, Bin; Liu, Hong-Yuan; Mai, Yiu-Wing; Feng, Xi-Qiao; Yu, Shou-Wen; Aerospace Mech & M'tronic Eng; Aerospace Mech & M'tronic Eng; Aerospace Mech & M'tronic EngFracture mechanics analysis of the effects of temperature and material mismatch on the Smart-Cut® technology., Engineering Fracture Mechanics, vol.75, 17, 2008,pp 4996-5006
2009Fracture mechanics analysis on Smart-Cut® technology. Part 1: Effects of stiffening wafer and defect interactionGu, Bin; Liu, Hong-Yuan; Mai, Yiu-Wing; Feng, Xi-Qiao; Yu, Shou-Wen; Aerospace Mech & M'tronic Eng; Aerospace Mech & M'tronic Eng; Aerospace Mech & M'tronic EngFracture mechanics analysis on Smart-Cut® technology. Part 1: Effects of stiffening wafer and defect interaction, Acta Mechanica Sinica, vol.25, 1, 2009,pp 73-81
2009Fracture mechanics analysis on Smart-Cut® technology. Part 2: Effect of bonding flawsGu, Bin; Liu, Hong-Yuan; Mai, Yiu-Wing; Feng, Xi-Qiao; Yu, Shou-Wen; Aerospace Mech & M'tronic Eng; Aerospace Mech & M'tronic Eng; Aerospace Mech & M'tronic EngFracture mechanics analysis on Smart-Cut® technology. Part 2: Effect of bonding flaws, Acta Mechanica Sinica, vol.25, 2, 2009,pp 197-203
2008Fracture Mechanics Analysis on Smart-Cut® Technology: Effects of Stiffening Wafer and Defect InteractionGu, Bin; Liu, Hong-Yuan; Mai, Yiu-Wing; Feng, Xi-Qiao; Yu, Shou-Wen; Aerospace Mech & M'tronic Eng; Aerospace Mech & M'tronic Eng; Aerospace Mech & M'tronic EngFracture Mechanics Analysis on Smart-Cut® Technology: Effects of Stiffening Wafer and Defect Interaction, Advanced Materials Research, vol.33-37, N/A, 2008,pp 67-72
2009Mechanics of microtubules modeled as orthotropic elastic shells with transverse shearingGu, Bin; Mai, Yiu-Wing; Ru, Chongqing; Aerospace Mech & M'tronic Eng; Aerospace Mech & M'tronic Eng; Aerospace Mech & M'tronic EngMechanics of microtubules modeled as orthotropic elastic shells with transverse shearing, Acta Mechanica, vol.207, 3-4, 2009,pp 195-209
2006A theoretical model on piezoelectric fibre pullout with electric inputGu, Bin; Liu, Hong-Yuan; Mai, Yiu-Wing; Aerospace Mech & M'tronic Eng; Aerospace Mech & M'tronic Eng; Aerospace Mech & M'tronic EngA theoretical model on piezoelectric fibre pullout with electric input, Engineering Fracture Mechanics, vol.73,(14),2006,pp 2053-2066