Browsing by Author Feng, Xi-Qiao

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Showing results 1 to 9 of 9
Issue DateTitleAuthor(s)Citation
2008Effects of particle size, particle/matrix interface adhesion and particle loading on mechanical properties of particulate-polymer compositesMai, Yiu-Wing; Feng, Xi-Qiao; Fu, Shaoyun; Lauke, Bernd; Aerospace Mech & M'tronic EngEffects of particle size, particle/matrix interface adhesion and particle loading on mechanical properties of particulate-polymer composites, Composites Part B: Engineering, vol.39, N/A, 2008,pp 933-961
2002Evaluation of thermo-elastic properties of three-dimensional orthogonal woven compositesLu, Meng; Ye, Lin; Chen, Zuo-Rong; Feng, Xi-Qiao; Yu, Shou-Wen; Aerospace Mech & M'tronic Eng; Aerospace Mech & M'tronic EngEvaluation of thermo-elastic properties of three-dimensional orthogonal woven composites, Composites Part B-Engineering, vol.33,(3),2002,pp 241-251
2008Fracture mechanics analysis of the effects of temperature and material mismatch on the Smart-Cut® technology.Gu, Bin; Liu, Hong-Yuan; Mai, Yiu-Wing; Feng, Xi-Qiao; Yu, Shou-Wen; Aerospace Mech & M'tronic Eng; Aerospace Mech & M'tronic Eng; Aerospace Mech & M'tronic EngFracture mechanics analysis of the effects of temperature and material mismatch on the Smart-Cut® technology., Engineering Fracture Mechanics, vol.75, 17, 2008,pp 4996-5006
2009Fracture mechanics analysis on Smart-Cut® technology. Part 1: Effects of stiffening wafer and defect interactionGu, Bin; Liu, Hong-Yuan; Mai, Yiu-Wing; Feng, Xi-Qiao; Yu, Shou-Wen; Aerospace Mech & M'tronic Eng; Aerospace Mech & M'tronic Eng; Aerospace Mech & M'tronic EngFracture mechanics analysis on Smart-Cut® technology. Part 1: Effects of stiffening wafer and defect interaction, Acta Mechanica Sinica, vol.25, 1, 2009,pp 73-81
2009Fracture mechanics analysis on Smart-Cut® technology. Part 2: Effect of bonding flawsGu, Bin; Liu, Hong-Yuan; Mai, Yiu-Wing; Feng, Xi-Qiao; Yu, Shou-Wen; Aerospace Mech & M'tronic Eng; Aerospace Mech & M'tronic Eng; Aerospace Mech & M'tronic EngFracture mechanics analysis on Smart-Cut® technology. Part 2: Effect of bonding flaws, Acta Mechanica Sinica, vol.25, 2, 2009,pp 197-203
2008Fracture Mechanics Analysis on Smart-Cut® Technology: Effects of Stiffening Wafer and Defect InteractionGu, Bin; Liu, Hong-Yuan; Mai, Yiu-Wing; Feng, Xi-Qiao; Yu, Shou-Wen; Aerospace Mech & M'tronic Eng; Aerospace Mech & M'tronic Eng; Aerospace Mech & M'tronic EngFracture Mechanics Analysis on Smart-Cut® Technology: Effects of Stiffening Wafer and Defect Interaction, Advanced Materials Research, vol.33-37, N/A, 2008,pp 67-72
2003A micromechanical model for interpenetrating mutilphase compositesMai, Yiu-Wing; Qin, Qing; Feng, Xi-Qiao; Aerospace Mech & M'tronic Eng; Aerospace Mech & M'tronic EngA micromechanical model for interpenetrating mutilphase composites, Computational Materials Science, vol.28,(3-4),2003,pp 486-493
2002A micromechanics model for estimating the effective thermoelastic properties of layered mediaLu, Meng; Chen, Zuo-Rong; Feng, Xi-Qiao; Yu, Shou-Wen; Aerospace Mech & M'tronic EngA micromechanics model for estimating the effective thermoelastic properties of layered media, Composites Science and Technology, vol.62,(2),2002,pp 441-449
2004Quasi-Micromechanical Damage Model For Brittle Solids With Interacting MicrocracksQin, Qing; Feng, Xi-Qiao; Yu, Shou-Wen; Aerospace Mech & M'tronic EngQuasi-Micromechanical Damage Model For Brittle Solids With Interacting Microcracks, Mechanics of Materials, vol.36,(3),2004,pp 261-273