Browsing by Author Mai, Yiu-Wing

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Issue DateTitleAuthor(s)Citation
20153D network graphene interlayer for excellent interlaminar toughness and strength in fiber reinforced compositesDu, Xusheng; Jia, Jingjing; Mai, Yiu-Wing; Chen, Chao; Kim, Jang-Kyo; Sun, Xinying; Aerospace Mech & M'tronic Eng; Aerospace Mech & M'tronic Eng; Aerospace Mech & M'tronic Eng3D network graphene interlayer for excellent interlaminar toughness and strength in fiber reinforced composites, Carbon, vol.95, N/A, 2015,pp 978-986
2008Accumulation Damage Mode for Ferroelectric Ceramics Subjected to Mode III Fatigue Loading ConditionsMai, Yiu-Wing; Wang, Baolin; Aerospace Mech & M'tronic Eng; Aerospace Mech & M'tronic EngAccumulation Damage Mode for Ferroelectric Ceramics Subjected to Mode III Fatigue Loading Conditions, International Journal of Damage Mechanics, vol.17, 1, 2008,pp 29-44
2006Advances in vapor pressure modeling for electronic packagingMai, Yiu-Wing; Wong, E H; Koh, S W; Lee, Kyu-Haeng; Lim, K-M; Lim, T B; Aerospace Mech & M'tronic Eng; Aerospace Mech & M'tronic EngAdvances in vapor pressure modeling for electronic packaging, IEEE Transactions on Advanced Packaging, vol.29,(4),2006,pp 751-759
2004Analytical Approximate Solution For Double Ellipsoidal Heat Source In Finite Thick PlateMai, Yiu-Wing; Simpson, Stephen; Nguyen, N T; Ohta, A; Aerospace Mech & M'tronic Eng; Electrical EngineeringAnalytical Approximate Solution For Double Ellipsoidal Heat Source In Finite Thick Plate, Welding Journal, vol.83,(3),2004,pp 82S-93S
2009Analytical Solution for the Damped-Dynamics of Printed Circuit Board and Applied to Study the Effects of Distorted Half-Sine Support ExcitationMai, Yiu-Wing; Wong, E.H.; Woo, Matthew; Aerospace Mech & M'tronic EngAnalytical Solution for the Damped-Dynamics of Printed Circuit Board and Applied to Study the Effects of Distorted Half-Sine Support Excitation, IEEE Transactions on Advanced Packaging, vol.32, 2,pp 536-545
2007Analytical solutions for interconnect stress in board level drop impactMai, Yiu-Wing; Wong, E H; Lim, K-M; Lim, T B; Seah, Simon K. W.; Aerospace Mech & M'tronic Eng; Aerospace Mech & M'tronic EngAnalytical solutions for interconnect stress in board level drop impact, IEEE Transactions on Advanced Packaging, vol.30,(4),2007,pp 654-664
2009Analytical Solutions for PCB Assembly Subjected to Mismatched Thermal ExpansionMai, Yiu-Wing; Lim, K-M; Wong, E.H.; Aerospace Mech & M'tronic EngAnalytical Solutions for PCB Assembly Subjected to Mismatched Thermal Expansion, IEEE Transactions on Advanced Packaging, vol.32, 3,pp 2009-602
2013Anelastic behavior in GaAs semiconductor nanowiresChen, Bin; Liao, Xiaozhou; Mai, Yiu-Wing; Ringer, Simon; Wang, Yanbo; Gao, Q.; Jagadish, Chennupati; Tan, H H; Zou, Jin; Aerospace Mech & M'tronic Eng; Aerospace Mech & M'tronic Eng; Aerospace Mech & M'tronic Eng; Aerospace Mech & M'tronic Eng; Aerospace Mech & M'tronic EngAnelastic behavior in GaAs semiconductor nanowires, Nano Letters: a journal dedicated to nanoscience and nanotechnology, vol.13, 7, 2013,pp 3169-3172
2014Annealing embrittlement of Fe78Si9B13 (METGLAS-2605S2)Kater, Peter; Mai, Yiu-Wing; Cadogan, J.M.; Campbell, Stewart; Foley, C. P.; Jing, J; Aerospace Mech & M'tronic Eng; Aerospace Mech & M'tronic EngAnnealing embrittlement of Fe78Si9B13 (METGLAS-2605S2), Hyperfine Interactions, vol.226, 1-3, 2014,pp 7-14
2008Anomalous electrical conductivity and percolation in carbon nanotube compositesMai, Yiu-Wing; Lu, C; Aerospace Mech & M'tronic EngAnomalous electrical conductivity and percolation in carbon nanotube composites, Journal of Materials Science, vol.43, 17, 2008,pp 6012-6015
2003Anti-plane fracture of a functionally graded material stripMai, Yiu-Wing; Sun, Yu-Guo; Wang, B L; Aerospace Mech & M'tronic EngAnti-plane fracture of a functionally graded material strip, European Journal Of Mechanics A-Solids, vol.22,(3),2003,pp 357-368
2012Antiferroelectric-like properties and enhanced polarization of Cu-doped K 0.5Na 0.5NbO 3 piezoelectric ceramicsMai, Yiu-Wing; Fan, H.Q; Huang, Haitao; Ke, Shan-Ming; Lee, H.K; Zhou, Li-Min; Aerospace Mech & M'tronic EngAntiferroelectric-like properties and enhanced polarization of Cu-doped K 0.5Na 0.5NbO 3 piezoelectric ceramics, Applied Physics Letters, vol.101, 8, 2012,pp 082901-1-082901-4
2007Applicability of the crack-face electromagnetic boundary conditions for fracture of magnetoelectroelastic materialsMai, Yiu-Wing; Wang, Baolin; Aerospace Mech & M'tronic Eng; Aerospace Mech & M'tronic EngApplicability of the crack-face electromagnetic boundary conditions for fracture of magnetoelectroelastic materials, International Journal of Solids and Structures, vol.44,(2),2007,pp 387-398
2003The application of the essential work of fracture methodology to the plane strain fracture of ABS 3-point bend specimensCotterell, Brian; Mai, Yiu-Wing; Bernal, C; Cisilino, A; Frontini, Patricia; Luna, P; Aerospace Mech & M'tronic Eng; Aerospace Mech & M'tronic EngThe application of the essential work of fracture methodology to the plane strain fracture of ABS 3-point bend specimens, Polymer, vol.44,(4),2003,pp 1145-1150
2009Approximate analytic and numerical study on indentation of cellular/foam film with glass substrateMai, Yiu-Wing; Song, Huaihe; Tian-You, Fan; Aerospace Mech & M'tronic EngApproximate analytic and numerical study on indentation of cellular/foam film with glass substrate, Acta Physica Sinica (Chinese Physics), vol.58, N/A,pp S189-S192
2003Asymptotic fields for dynamic crack growth in non-associative pressure sensitive materialsMai, Yiu-Wing; Qin, Qing; Zhang, Xiao; Aerospace Mech & M'tronic Eng; Aerospace Mech & M'tronic EngAsymptotic fields for dynamic crack growth in non-associative pressure sensitive materials, International Journal of Solids and Structures, vol.40,(3),2003,pp 649-670
2002Atomic force microscopy study of surface roughening of sputter-deposited TiN thin filmsMai, Yiu-Wing; Jiang, N; Liu, Z J; Shen, Y G; Aerospace Mech & M'tronic EngAtomic force microscopy study of surface roughening of sputter-deposited TiN thin films, Journal of Applied Physics, vol.92,(7),2002,pp 3559-3563
2015Balanced electrical, thermal and mechanical properties of epoxy composites filled with chemically reduced graphene oxide and rubber nanoparticlesLiu, Hong-Yuan; Mai, Yiu-Wing; Tang, Long-Cheng; Gong, Li-Xiu; Zhao, Li; Aerospace Mech & M'tronic Eng; Aerospace Mech & M'tronic Eng; Mechanical & Mechatronic EnginBalanced electrical, thermal and mechanical properties of epoxy composites filled with chemically reduced graphene oxide and rubber nanoparticles, Composites Science and Technology, vol.121, N/A, 2015,pp 104-114
2002BEM for crack-hole problems in thermopiezoelectric materialsMai, Yiu-Wing; Qin, Qing; Aerospace Mech & M'tronic Eng; Aerospace Mech & M'tronic EngBEM for crack-hole problems in thermopiezoelectric materials, Engineering Fracture Mechanics, vol.69,(5),2002,pp 577-588
2005A bifurcation-based decohesion model for simulating the transition from localization to decohesion with the MPMMai, Yiu-Wing; Chen, Zu Pei; Shen, Luming; Shen, Yeo-Gen; Aerospace Mech & M'tronic EngA bifurcation-based decohesion model for simulating the transition from localization to decohesion with the MPM, Zeitschrift Fur Angewandte Mathematik Und Physik, vol.56,(5),2005,pp 908-930